Thermally enhanced semiconductor device utilizing a vacuum to ultimately enhance thermal dissipation

摘要: A semiconductor device having a heat sink is provided in which an opening through the enables vacuum source to be applied die mounted surface. In one form, attached mounting surface of leadframe. The leadframe also has plurality leads are electrically coupled die. and portions encapsulated package body. Also incorporated body sink. extends exposes portion used apply during formation so that held close proximity. closeness provides good thermal conduction path from ambient, thereby enhancing dissipation properties device.