Adhesive tape for electronic parts and liquid adhesive
作者： Takeshi Nishigaya , Takeshi Hashimoto , Fumiyoshi Yamanashi , Katsuji Nakaba , Yukinori Sakumoto
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摘要: This invention provide an adhesive tape by which adhesion to a metal spreader is not required and cutting process necessary. The comprises layer provided on at least one surface of sheet, said being semi-cured into B-stage comprised of: (a) piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer the formula (I): ##STR1## wherein, k, m, n are molar ratios taking as l, k number 3-175, m 0.3 93; (b) compound having two maleimide groups, ratio component based 100 parts weight in range 10 900 weight, composed layers each different status semi-cure.
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