作者: R.K. Sharma , P. Ganesan
DOI: 10.13189/UJME.2014.020602
关键词:
摘要: The solidification process of nanofluid (water + copper nanoparticles) has been studied numerically in this paper. horizontal walls the cavity are insulated while inclined kept at constant but different temperatures. effects nanoparticle dispersions (ϕ = 0%, 10% and 20%) temperature difference between hot cold wall on Cu-water inside is investigated numerically. Enthalpy-porosity technique used to trace solid-liquid interface. It illustrated that suspended nanoparticles substantially increase heat transfer rate which further increased by difference.