Method and system for etching substrates for printed circuit boards

摘要: A method for etching upper and lower sides, separately, of substrates printed circuit boards includes steps of the substrates in unit (U1) by spraying an etchant to the side while substrates being conveyed horizontally the conveyor (D) have thereof covered surface protector (E) against application spray. The having the etched cleaned removing station (H) to remove residual etchant, is reversed upside down reversing mechanism (R). Then, side, thus oriented downward yet etch, substrates is etched (U2) while already Therefore, can be uniformly etched, substrate reversing mechanism (R) operate smoothly since no remains sticking reversing mechanism.