Optimal phosphorous content selection for the soldering reaction of Ni-P under bump metallization with Sn-Ag-Cu solder
作者： Yung-Chi Lin , Jenq-Gong Duh
DOI: 10.1007/S11664-006-0215-9
关键词:
摘要: Nickel plating has been used as the under bump metallization (UBM) in microelectronics industry. The electroplated Ni-P UBM with different phosphorous contents (7 wt.%, 10 and 13 wt.%) was to evaluate interfacial reaction between Sn-3Ag-0.5Cu solder paste during multiple reflow. (Cu,Ni)6Sn5 intermetallic compounds (IMC) formed SnAgCu solder/Ni-P interface after first For three times reflow, (Ni,Cu)3Sn4 IMC formed, while spalled into matrix. With further increasing cycles of Ni-Sn-P layer for Ni-10wt.%P Ni-13wt.%P UBM. However, almost no revealed Ni-7wt.%P even ten In consideration wettability UBM, SnAgCu/Ni-P, dissolution optimal selection proposed also discussed.
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Abner Brenner, Electrodeposition of alloys : principles and practice Academic Press. ,(1963)
Joseph I. Goldstein, Dale E. Newbury, Joseph R. Michael, Nicholas W.M. Ritchie, John Henry J. Scott, David C. Joy, Scanning Electron Microscopy and X-Ray Microanalysis Transactions of the American Microscopical Society. ,vol. 102, pp. 59- ,(2018) , 10.1007/978-1-4939-6676-9
Kejun Zeng, Roger Stierman, Tz-Cheng Chiu, Darvin Edwards, Kazuaki Ano, K. N. Tu, Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability Journal of Applied Physics. ,vol. 97, pp. 024508- ,(2005) , 10.1063/1.1839637
S. K. Kang, R. S. Rai, S. Purushothaman, Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders Journal of Electronic Materials. ,vol. 25, pp. 1113- 1120 ,(1996) , 10.1007/BF02659912
Szu-Tsung Kao, Jenq-Gong Duh, Interfacial reactions and compound formation of Sn-Ag-Cu solders by mechanical alloying on electroless Ni-P/Cu under bump metallization Journal of Electronic Materials. ,vol. 34, pp. 1129- 1134 ,(2005) , 10.1007/S11664-005-0241-Z
Mulugeta Abtew, Guna Selvaduray, Lead-free Solders in Microelectronics Materials Science and Engineering: R: Reports. ,vol. 27, pp. 95- 141 ,(2000) , 10.1016/S0927-796X(00)00010-3
Yung-Chi Lin, Jenq-Gong Duh, Phase transformation of the phosphorus-rich layer in SnAgCu/Ni-P solder joints Scripta Materialia. ,vol. 54, pp. 1661- 1665 ,(2006) , 10.1016/J.SCRIPTAMAT.2006.01.006
Guh-Yaw Jang, Jenq-Gong Duh, The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu Under-bump metallization Journal of Electronic Materials. ,vol. 34, pp. 68- 79 ,(2005) , 10.1007/S11664-005-0182-6
Naoki Torazawa, Shigeo Arai, Yoshihisa Takase, Katsuhiro Sasaki, Hiroyasu Saka, Transmission Electron Microscopy of Interfaces in Joints between Pb-Free Solders and Electroless Ni-P Materials Transactions. ,vol. 44, pp. 1438- 1447 ,(2003) , 10.2320/MATERTRANS.44.1438
Ann A. Liu, H. K. Kim, K. N. Tu, Paul A. Totta, Spalling of Cu6Sn5 spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films Journal of Applied Physics. ,vol. 80, pp. 2774- 2780 ,(1996) , 10.1063/1.363728