作者: Robert Marvin Kalstabakken , Steve Jerome Johnson , Harold Dean Lakoduk , Tim Gordon Lange , Kent Gregory Messing
DOI:
关键词:
摘要: Embodiments of the invention provide enclosures for electronic components and methods manufacturing same. In one embodiment, enclosure includes first second sidewalls formed from a single elongated piece sheet metal. The sidewall, third fourth sidewall define an interior space enclosure. At least edge region folded inwardly relative to form mounting channel. further backwall coupled with edges door hingedly at sidewalls.