Immersion cooled high density electronic assembly

摘要: An immersion cooling system for high density electronic assemblies such as computers includes a container holding an inert liquid, and stacks of circuit modules arranged in generally radial pattern within the container. Coolant supply columns coolant removal alternate between adjacent around pattern. The include distribution manifolds which distribute incoming at all levels to provide flow modules. passes boards preferably along channels formed by chips aligned rows. After passing across heated rises flows over standpipes from container, pump heat exchanger recools recirculates coolant. Pump up down systems are also provided withdrawing reservoir servicing circuitry.