High performance fin configuration for air cooled heat sinks

摘要: A heat dissipation system and method for extracting from an integrated circuit device includes, in one example embodiment, a thermally conductive base plate. The further includes array of substantially parallel fin structures having top bottom portions. plate is attached to the such that close proximity portion. portions extend outwardly portion extends laterally beyond array. are sufficient size so as allow components on motherboard encroach around device.