EVALUATION ON THE THERMAL AND STRUCTURAL PROPERTIES OF COPPER ALUMINUM OXIDE (Cu-Al2O3) THIN FILM ON AL SUBSTRATE: EFFECT OF ANNEALING TEMPERATURE
作者： Wei Qiang Lim , Subramani Shanmugan , Mutharasu Devarajan
DOI: 10.1142/S0218625X19500173
关键词:
摘要: Layer stacking technique is incorporated in the deposition of copper aluminium oxide (Cu-Al2O3) thin films on Al substrate using RF magnetron sputtering. The Cu/Al2O3 stack sputtered Cu and Al2O3 target at ambient temperature then annealed to yield resultant Cu-Al2O3 films. structural properties are investigated through X-ray Diffraction (XRD) whereas chemical structure studied Fourier-transform infrared (FTIR). thermal conductivity analyzer used evaluate coated film substrate. XRD analysis revealed that synthesized polycrystalline composed mainly CuAl2O4 phase along with CuO phases. substrates showed improvement terms diffusivity compared bare sample 400∘C exhibited a significant difference (Δk=11W/mK) Al. displayed by verified TIMs did enhance path entire allowing heat dissipate surrounding environment more efficiently, thereby improving dissipation system. From results observed, it can be concluded made as alternative TIM management application.
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