Surface reactions in microelectronics process technology.
作者： Galit Levitin , Dennis W. Hess
DOI: 10.1146/ANNUREV-CHEMBIOENG-061010-114249
关键词:
摘要: Current integrated circuit (IC) manufacturing consists of more than 800 process steps, nearly all which involve reactions at surfaces that significantly impact device yield and performance. From initial surface preparation through film deposition, patterning, etching, residue removal, metallization, an understanding interactions is critical to the successful continuous scaling, yield, reliability electronic devices. In this review, some most important drive development microelectronic fabrication are described. The discussed do not constitute comprehensive coverage topic in IC manufacture but have been selected demonstrate importance surface/interface new materials, processing sequences, integration challenges. Specifically, review focuses on related cleaning/preparation, semiconductor growth, diele...
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