Bending reliability of Ni–MWCNT composite solder with a differential structure

摘要: Abstract A carbon nanotube (CNT) has remarkable properties, but it disadvantages in application because of its dispersal- and bonding-related issues. Metal–CNT composite materials are necessary solving these problems. In this study, nickel (Ni)–multi-walled CNTs (Ni–MWCNTs) synthesized through sequential processing, functionalizing, electroless plating processes to deposit Ni nanoparticles on MWCNTs. The Ni–MWCNTs used fabricate solders with various contents (0, 0.05, 0.1, 0.2 wt%). test kit for the 3-point bending study is designed a differential package structure evaluate reliabilities Ni–MWCNT contents. crack initiation propagation microstructure evolution solder joints also investigated. improve BGA indicate that highest cycle fails 0.1 wt% Ni–MWCNTs. chemical composition distribution investigated electron probe microanalysis.