Led lighting source and led lighting apparatus
作者： Keiji Nishimoto , Hideo Nagai , Masanori Shimizu , Noriyasu Tanimoto , Takeshi Saito
DOI:
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摘要: An LED lighting source preventing heat deterioration and improving luminous efficiency includes a mounting substrate having wiring pattern on first main surface thereof plurality of bare chips, each composed semiconductor layer second respectively different conductivity, an active disposed therebetween, metal electrode the substantially equal in area thereto, chip being joined to according flip form junction between electrode. Each is formed so that at least 20% Thermal resistance from layers through substrate, which back thereof, set 3.0 9C/W or lower.
lens.org 参考文章(23)
Edward J. DeWath, Mark J. Dyer, Simon J. Field, William K. Bischel, Michael J. Brinkman, David A. G. Deacon, Solid state optical data reader using an electric field for routing control ,(1997)
Steven N. Hass, Michael L. Bolan, Integrated circuit for identifying an item via a serial port ,(1995)
Steven D. Lester, Jonathan J. Wierer, Daniel A. Steigerwald, Highly reflective ohmic contacts to III-nitride flip-chip LEDs ,(2001)
Simon S. Ang, Keith C. Burgers, Kraig J. Olejniczak, Errol V Porter, Conversion of electrical energy from one form to another, and its management through multichip module structures ,(2000)
Nicholas M. G. Fekete, Robert D. Lee, Steven N. Hass, Michael L. Bolan, Electronic labeling systems and methods and electronic card systems and methods ,(1998)
Edward J. DeWath, Mark J. Dyer, Simon J. Field, William K. Bischel, Michael J. Brinkman, David A.G. Deacon, Frequency converter optical source for switched waveguide ,(1997)
James T. Petroski, Christopher L. Bohler, Greg E. Burkholder, Stanton E. Weaver, Mathew L. Sommers, Charles A. Becker, Anthony D. Pollard, Robert F. Karlicek, High power led power pack for spot module illumination ,(2002)
Motoo Asai, Toyoaki Tanaka, Hiroaki Kodama, Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method ,(2003)
Raf Vandersmissen, Staf Borghs, Eric Beyne, A method for transferring and stacking of semiconductor devices ,(2001)