Study of Curing Kinetics of an Epoxy-Amine Adhesive System Using a Calorimetric Analysis Approach

作者: Xiaoping Guo

DOI: 10.1080/03602550802391391

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摘要: Various dynamic curing experiments for an epoxy-amine adhesive system were conducted using a differential scanning calorimetry. The obtained data corrected proposed baseline method, and fitted to generalized autocatalytic model of chemical reaction determine the parameters. It was shown that with classical fourth-order Runge-Kutta numerical algorithm, kinetic as derived from could be used reliably simulate industrial process, which may include nonisothermal quasi-isothermal steps. In addition, various performed; heat flows cure measured, numerically compared relevant calculations.

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