作者: Fang Hongchang , Wang Wenjian
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摘要: The invention provides etching liquid and a method for fine lines of flexible circuit board by using the same. takes water as solvent, comprises following solutes concentration: 130g/L-250g/L copper chloride dehydrate, 100 mL/L-150 mL/L 30% hydrochloric acid, 26.7g/L-128.4g/L ammonium chloride, 0.5g/L-16g/L banking agent 2g/L-6g/L secondary wherein is corrosion inhibitor; solvent polyhydric alcohol. an acid which high in dissolved quick velocity, does not contain hydrogen peroxide or sodium hypochlorite, low content, mixed with to achieve purpose relieving lateral erosion while improving velocity. utilizing disclosed capable completing more rapidly within short time, straight flat etched factor, therefore, can be used processing board.