Semiconductor device and method of manufacturing same
作者： Shintaro Yamamichi , Takehiko Maeda , Hideya Murai , Kouji Soejima , Kentaro Mori
DOI:
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摘要: A highly reliable semiconductor device in which connection reliability is assured at very small vias comprises: a substrate; first wiring structure placed on the substrate and having one or more layers, insulating layers via; second via third an external terminal provided structure. The via, connected to layer of terminal, has interface disposed end that side terminal.
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