Method of forming a three-dimensional integrated inductor
作者： Douglas H. Weisman , Robert E. Stengel , Ronald C. Alford , George W. Marlin
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摘要: A three-dimensional inductor coil is fabricated on top of a semiconductor substrate. The fabrication process includes the steps depositing first photoresist layer (406), forming trench therein, and filling with electroplated metal (404). second (408) deposited, trenches (410) are formed therein filled (412). third (416) deposited (418) then (420). first, second, layers (406, 408, 416) removed to expose multi-loop (500, 550).
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