Characterization of neon implantation damage in silicon

作者: E. Oliviero , S. Peripolli , P.F.P. Fichtner , L. Amaral

DOI: 10.1016/J.MSEB.2004.05.014

关键词:

摘要: Abstract The damage accumulation in neon-implanted silicon, with doses ranging from 1 × 1016 to 5 1016 Ne cm−2, was explored. To avoid amorphization, samples were implanted at 250  ° C. As and annealed investigated by Rutherford backscattering spectrometry under channeling conditions (RBS/C) transmission electron microscopy (TEM) quantify characterize the lattice damage. Anneals performed 800 °C during 30 min. In as-implanted samples, a high density of small bubbles is observed all along ion distribution, forming uniform continuous layer. Clusters interstitial defects are also present deeper part layer corresponding end range ions. After annealing, cavities formed together extended characterized as {3 1 1} defects. results discussed comparison case helium implantation highlight bubble formation mechanisms.

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