Cooling device for semiconductor chip

摘要: PURPOSE:To enable to cool a semiconductor chip in such manner that uniform surface temperature will be obtained by method wherein liquid mist saturated state is jetted on the back side of each chip, and evaporated an LSI chip. CONSTITUTION:The cooling medium sent from tube 5 formed into 9 nozzle 8, it sprayed 1. When reaches 1, heated up instantly gasified. The cooled having its heat taken away above-mentioned evaporation, but as diameter drops small, can uniformly at low heating power. vapor flows out outside outlet port 6. lowed 6, introduced condenser 11 gathered once receiver 12 after condensation liquefaction. pumped pump 13, supplied 8 through introducing pipe 5.