Integrated circuit inductor having a patterned ground shield
作者： Zhaoyin D. Wu , Parag Upadhyahya , Shuxian Wu , Jing Jing , Xuewen Jiang
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摘要: An inductor structure can be implemented within a semiconductor integrated circuit (IC). The include coil of conductive material having first terminal and second each located at an opposing end the coil. patterned ground shield including plurality fingers IC process layer between substrate IC. also isolation wall formed to encompass shield. coupled one finger.
lens.org 参考文章(10)
Chryssoula Kyriazidou, On-chip differential multi-layer inductor ,(2002)
Y.E. Chen, D. Bien, D. Heo, J. Laskar, Q-enhancement of spiral inductor with N/sup +/-diffusion patterned ground shields international microwave symposium. ,vol. 2, pp. 1289- 1292 ,(2001) , 10.1109/MWSYM.2001.967129
Kai-Yi Huang, Ta-Hsun Yeh, Yuh-Sheng Jean, Integrated inductor structure ,(2008)
Shuxian Chen, Jeffrey T. Watt, Integrated circuit inductor with doped substrate ,(2010)
John E. Scoggins, Shahriar Moinian, Differential Inductor for Use in Integrated Circuits ,(2006)
Chin Sun Shyu, Uei Ming Jow, Chang Sheng Chen, Embedded inductor devices and fabrication methods thereof ,(2007)
Rex Everrett Lowther, Solid state inducting device ,(2002)
Jay Yu, Low substrate loss inductor ,(2003)
o Société Civile S.P.I.D. Gamand, o Société Civile S.P.I.D. Butaye, Benoít c, Patrice c, Electrical device isolation structure ,(2001)
Lukas Frederik Tiemeijer, Alexé Levan Nazarian, Optimized layout for low magnetic stray-field inductor ,(2009)