Aluminum nitride sintered body with high thermal conductivity and process for producing same

摘要: AlN-base sintered body with a high thermal conductivity is produced by: preparing compact of material comprising 100 parts by weight aluminum nitride and 0.1-10 weight, calculated on metal element, at least one component selected from the group consisting elements Groups 4a, 5a 6a Periodic Table, compounds thereof; sintering said temperature ranging 1500° to 2000° C. under non-oxidizing atmosphere having source boron and/or carbon supply. The include oxides, borides, nitrides carbides. W, Mo, Ta Ti. Oxides are converted other through sintering. This has good wettability for metallization enables simultaneous layer. Multilayer laminated circuit boards or substrates thereof can be produced.