Method for manufacturing a stimulus wafer for use in a wafer-to-wafer testing system to test integrated circuits located on a product wafer

摘要: A method, apparatus, and circuit distribution wafer (CDW) (16) are used to wafer-level test a product (14) containing one or more integrated circuits (ICs). The CDW contains circuitry which is the ICs on wafers (14). connection from made via compliant interconnect media (IM) (18). Through IM (18), tests under any set of conditions. external connectors conductors (20, 22, 24, 26) transmits receives data, control information, temperature control, like an tester (104). To improve performance testability, heating/cooling (80 82) may be segmented into two sections for greater accurate testing.