Intaglio printing method, intaglio printer, method of formation of bumps, or wiring pattern, apparatus therefor, bump electrode and printed circuit board
作者： Makoto Kinoshita
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摘要: An intaglio printing method and an printer are proposed, which suitable for forming a wiring pattern and/or bumps such as bump electrodes on print receiving material is to be performed, substrate semiconductor package, using paste or fused metal. In addition, of the substrate, method, pattern, apparatus carrying out electrode proposed.
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