Cell interconnection without glueing or soldering for crystalline Si photovoltaic modules

摘要: In order to maximize the power output of polycrystalline silicon PV-modules, in previous work we have already tested rectangular cells 39 × 156 mm which are overlapped along long sides. The low current density at cell overlap allows interconnections need neither soldering nor glueing, but use metallic strips inserted between region. contact is established by pressure applied module during lamination and retained slightly bent solidified encapsulant. Here report on term stability different materials cross sections eight modules 240 W class monitored for up 24 months outdoor operation a variety small 5-cell exposed rapid ageing tests with 1000 thermal cycles. Cells three electrode designs were Cu, Ag, SnPbAg Sn. Focussing especially series resistance, fill factor peak power, it found that Ag-coated perform equally well practically same as soldered interconnections. Due 70–90% savings copper simpler manufacturing cost PV-modules may thus be reduced further.