Simultaneous high-capacity optical and microwave data transmission over metal waveguides.

摘要: The implementation of power efficient and high throughput chip-to-chip interconnects is necessary to keep pace with the bandwidth demands in high-performance computing platforms. In recent years, considerable effort has been made optimize inter-chip communications using traditional copper waveguides. Also, optical links are extensively investigated as an alternative technology for fast data routing. For first time, we experimentally demonstrate simultaneous microwave high-speed transmission over metallic waveguides embedded polymer. demonstration significant it merges two layers onto same structure towards increased aggregated bandwidth, energy-efficient movement.