Joining of sintered silicon carbide using ternary Ag–Cu–Ti active brazing alloy
作者： Y. Liu , Z.R. Huang , X.J. Liu
DOI: 10.1016/J.CERAMINT.2009.03.016
关键词:
摘要: … to itself by Ag–35.25 wt%Cu–1.75 wt%Ti filler alloy at 860 C, … at room temperature and high temperature were measured by … by ternary Ag–Cu–Ti foil both at room temperature and high …
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