Primer compositions exhibiting heat resistant bonding

摘要: Improved primer compositions comprise A) at least one member of a specified group ethylenically unsaturated organosilicon compounds containing silicon-bonded alkoxy groups, B) silicone/organic copolymers prepared from esters organic acids and derived these acids, C) organohydrogensiloxane curing agents D) solvent. The improvement resides in the presence composition an peroxide amount sufficient to retain bonding properties temperatures 100°C. solvent portion preferably comprises 50 percent by weight alcohol 4 6 carbon atoms.