Three-level leadframe for no-lead packages
作者： Vinu Yamunan
DOI:
关键词:
摘要: A semiconductor device ( 700 ) having a leadframe with first plurality of segments 110 narrow end portion 111 in horizontal plane 211 and wide 112 second 212 ). The further includes 120 center 121 the plane, at least one 122 portions 123 third 213 ), which is located between planes.
lens.org 参考文章(3)
Chun-Yuan Li, Holman Chen, Jui-Hsiang Hung, Chin-Teng Hsu, Terry Tsai, Leadframe-based non-leaded semiconductor package and method of fabricating the same ,(2003)
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Keith W. Bailey, Semiconductor leadframe and package ,(1993)