Exposed lead interposer leadframe package

摘要: An interposer for use in an external lead or land pattern semiconductor package. The includes body which is molded from a dielectric material. defines opposed top and bottom surfaces, outer peripheral edge, inner edge. Embedded within the die pad itself surfaces surface of exposed substantially flush with body, edge collectively defining cavity interposer. A plurality electrically conductive leads are embedded at least partially therein. forms nonconductive barrier between each pad.