Stress-Strain Analysis of a Taper-Taper Adhesive-Bonded Joint Under Cylindrical Bending
作者： Jack E. Helms , Chihdar Yang , Su-Seng Pang
DOI: 10.1115/1.2812389
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摘要: A model of a taper-taper adhesive-bonded joint under cylindrical bending has been derived using first-order laminated plate theory. Shear correction factors were used to account for transverse shear deformation. A FORTRAN program was written to integrate the resulting system of twelve simultaneous, linear, first-order, differential equations with variable coefficients. The Linear Shooting Method was used to solve the model. A finite element model was developed using the COSMOS/M commercial finite element package to verify the analytical model for a cross-ply laminate. The analytical model results agreed well with the finite element models and predicted peak adhesive stresses within about 2% of the finite element model.
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