Semiconductor package with full plating on contact side surfaces and methods thereof
作者： Saravuth Sirinorakul
DOI:
关键词:
摘要: Embodiments of the present invention are directed to a semiconductor package with full plating on contact side surfaces. The includes top surface, bottom surface opposite and surfaces between Contacts located peripheral edges surface. Each contacts first that is flush second at one each continuously plated. Portions an internal layer exposed along package. has molding compound least partially encapsulating contacts, wherein part have different texture.
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