Infrared brazing of Ti50Ni50 shape memory alloy using pure Cu and Ti–15Cu–15Ni foils

作者: T.Y. Yang , R.K. Shiue , S.K. Wu

DOI: 10.1016/J.INTERMET.2004.03.020

关键词:

摘要: Abstract Infrared brazing of Ti 50 Ni using two filler metals was investigated in the study. Three phases, including Cu-rich, CuNiTi (Δ) and Ti(Ni,Cu), were observed /Cu/Ti joint after at 1150 °C. The Cu-rich phase rapidly consumed first 10 s brazing, eutectic mixture Ti(Ni,Cu) phases subsequently joint. Samples brazed for longer time resulted less more existence deteriorated shape memory effect joint, but could still preserve behavior even alloyed with a large number Cu. Therefore, higher recovery ratio specimens period. Extensive presence 2 (Ni,Cu) /Ticuni ® /Ti upon up to bending test not be performed due inherent brittleness matrix. Moreover, stable difficult removed completely by increasing either and/or temperature.

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