Method for manufacturing chip cards and card obtained thereby

摘要: The procedure for mfr. of a card containing semiconductor chip circuit includes covering one surface paper with self-adhesive layer which is resistant to high temperatures. This covered by protective layer. then introduced into an electrostatic printing machine where the required design applied un-coated side paper. area carrying cut size label surrounding design. An electronic module formed in cavity and this attached sheet once has been removed from on side. process may be four-colour process.