Fluoride ions at the Cu–fluoropolymer interface
作者： A. Naujokas , D. G. Abreu , G. A. Takacs , T. Debies , M. Mehan
DOI: 10.1002/SIA.5225
关键词:
摘要: Nanometer thick films of sputtered and evaporated Cu were deposited on the surfaces fluoropolymers poly(tetrafluoroethylene) (PTFE), poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) studied by both angle-resolved XPS at takeoff angles 10°, 45° 80° in situ argon ion etching. Higher yields fluoride to fluoropolymer ratio detected for than Cu. PFA FEP show enhanced interaction with produce ions relative more polycrystalline PTFE. At intermediate depths (takeoff angle 45°), exhibit strongest F 1s signals compared peaks. The amount reaches a maximum after brief Ar etching then decreases prolonged Compared untreated fluoropolymers, improved adhesion was observed that etched expose ions. Copyright © 2013 John Wiley & Sons, Ltd.
sci-hub.se 参考文章(24)
R. W. Burger, L. J. Gerenser, The Chemistry of Metal/Polymer Interface Formation: Relevance to Adhesion Metallized Plastics 3. pp. 179- 193 ,(1992) , 10.1007/978-1-4615-3416-7_15
D. Popovici, J.E. Klemberg-Sapieha, G. Czeremuszkin, E. Sacher, M. Meunier, L. Martinu, Copper metallization of Teflon AF1600, using evaporation and sputtering, for multilevel interconnect devices Microelectronic Engineering. ,vol. 33, pp. 217- 221 ,(1997) , 10.1016/S0167-9317(96)00048-2
Kozo Okada, Akio Kotani, Multiplet Structures of Cu 2p-XPS in La2CuO4, CuO and Cu Halides Journal of the Physical Society of Japan. ,vol. 58, pp. 2578- 2585 ,(1989) , 10.1143/JPSJ.58.2578
D. Popovici, K. Piyakis, M. Meunier, E. Sacher, Angle-resolved x-ray photoelectron spectroscopy comparison of copper/Teflon AF1600 and aluminum/Kapton metal diffusion Journal of Applied Physics. ,vol. 83, pp. 108- 111 ,(1998) , 10.1063/1.366706
Peter J. Cumpson, Angle-resolved XPS and AES: depth-resolution limits and a general comparison of properties of depth-profile reconstruction methods Journal of Electron Spectroscopy and Related Phenomena. ,vol. 73, pp. 25- 52 ,(1995) , 10.1016/0368-2048(94)02270-4
Chin‐An Chang, Yong‐Kil Kim, A. G. Schrott, Adhesion studies of metals on fluorocarbon polymer films Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. ,vol. 8, pp. 3304- 3309 ,(1990) , 10.1116/1.576583
Ming‐Kun Shi, Boris Lamontagne, Amine Selmani, Ludvik Martinu, X‐ray photoelectron spectroscopy study of x‐ray irradiated metal/fluoropolymer interfaces Journal of Vacuum Science and Technology. ,vol. 12, pp. 44- 50 ,(1994) , 10.1116/1.578902
C. C. Perry, J. Torres, S. R. Carlo, D. Howard Fairbrother, Reactivity of Cu with poly(tetrafluoroethylene) and poly(vinyl chloride): Effect of pre- and post-metallization modification on the metal/polymer interface Journal of Vacuum Science and Technology. ,vol. 20, pp. 1690- 1698 ,(2002) , 10.1116/1.1497989
A. Thran, M. Kiene, V. Zaporojtchenko, F. Faupel, CONDENSATION COEFFICIENTS OF AG ON POLYMERS Physical Review Letters. ,vol. 82, pp. 1903- 1906 ,(1999) , 10.1103/PHYSREVLETT.82.1903
S. Hüfner, Systematics of optical energy gaps and XPS core level satellites in CuO and copper dihalides Solid State Communications. ,vol. 47, pp. 943- 945 ,(1983) , 10.1016/0038-1098(83)90127-8