Esd protection device

作者: Jun Urakawa , Takahiro Sumi , Jun Adachi , Takahiro Kitadume

DOI:

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摘要: An ESD protection device includes a ceramic multilayer substrate including plurality of laminated insulating layers, an external electrode, at least one in-plane connecting conductor and interlayer conductor, mixture portion. The portion is provided along principal surface the layers dispersed material metal semiconductor; ceramic; metal, semiconductor, semiconductor coated with inorganic material; material, ceramic. connected to electrode conductor.

参考文章(107)
Richard L. Wahlers, Vernon E. Osborne, Resistance material, resistor and method of making the same ,(1981)
Jun Urakawa, Takahiro Sumi, Kumiko Hiehata, Takayuki Tsukizawa, Jun Adachi, ESD protection device and manufacturing method therefor ,(2012)
Zachary Charles Nathan Kratzer, Qing Zhang, Keith Bryan Hardin, Paul Kevin Hall, Die press process for manufacturing a z-directed component for a printed circuit board ,(2011)
Thomas Carl Hartman, Jonathan J. Woodworth, Jeffrey Joseph Kester, Surge arrester having controlled multiple current paths ,(1996)
Yasuhiro Shato, Takashi Kurihara, Miki Adachi, Tuyoshi Ogi, Toshiaki Ueda, Sung-Gyoo Lee, Surge absorber and production method therefor ,(2004)
Jun Urakawa, Takashi Noma, Substrate including an esd protection function ,(2010)
Takahiro Sumi, Takayuki Tsukizawa, Jun Adachi, Kumiko Ishikawa, Esd protection device and method for producing the same ,(2014)
Yoshimitsu Ishihara, Yukihiko Azuma, Fumiaki Naka, Mina Onishi, Discharge gap filling composition and electrostatic discharge protector ,(2010)