Heat-conducting insulating board and preparation method thereof, and electronic component
作者： Wang Yang , Song Yanlin , Zhang Youzhuan
DOI:
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摘要: The invention relates to the technical field of electronic circuit packaging substrate, and discloses a heat-conducting insulating board preparation method thereof, an component.The comprises metal substrate (1), first oxide layer (2), second (3) silica-containing coating (4) formed on (1)and stacked successively. thickness is prominently increased by sols with relatively low price; thermal conductivity improved using perhydropolysilazane solution; has good insulation performance property.
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