作者: Jules D. Levine
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摘要: Semiconductor spheres are arranged within a plastic sheet and laminated between two metal foil layers to make electrical contacts. A portion of each sphere is exposed on one side allow light entry. The back ohmic contact has spreading resistance which protects large array configurations from short circuits. Series interconnections cells, for higher voltage, can be made in the same processing sequence, coplanar with array. All manufacturing steps completed at temperatures less than 400° C.