Effects of material mismatch on interfacial cracking of ferroelectric film/substrate structures

摘要: Abstract This study investigates the effect of material mismatch on interfacial cracking in ferroelectric film/substrate structures, models misfit strain using a Somigliana screw dislocation dipole, and solves generalized stress functions, intensity factor (SIF) electric displacement (EDIF) piezoelectric coupled field based an equivalent model complex potential method. The results show that: (1) lattice degree is major influencing EDIF SIF; (2) effects elastic dielectric constant ratios substrate to film depend resulting from other two stiffness, respectively, however ratio can affect independently; (3) increasing lead monotonic significant increase when greater than 1, it cause obviously change has little (4) modest adjustment within specific range could be route decrease failure risk deposited substrate.