作者: Ke Chu , Zhaofang Liu , Chengchang Jia , Hui Chen , Xuebing Liang
DOI: 10.1016/J.JALLCOM.2009.10.040
关键词:
摘要: … Cu/diamond composites have been considered as a next generation of thermal … of these composites is to obtain a well bonded interface between the copper and the diamond. In this …