作者: S. Zakipour , M. Samavatian , A. Halvaee , A. Amadeh , A. Khodabandeh
DOI: 10.1016/J.MATLET.2014.11.158
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摘要: Abstract The liquid state diffusion bonding mechanism of stainless steel 316 to Ti-6Al-4 V using pure Cu interlayer has been investigated at 1100 °C for 60 min time. microstructure joint zone was analyzed in detail by scanning electron microscope and energy dispersive spectroscopy. microhardness shear strength tests were also applied characterize mechanical properties the joints. results showed that increasing thickness led extension increase final width. maximum 284 MPa obtained bond made with 50 µm thick while an thickness, values decreased 145 MPa could be attributed formation brittle intermetallics such as Cu2Ti CuTi interface.