Inhibiting Cracking of Interfacial Cu6Sn5 by Ni Additions to Sn-based Lead-free Solders
作者： Kazuhiro Nogita , Stuart D. McDonald , Hideaki Tsukamoto , Jonathan Read , Shoichi Suenaga
DOI: 10.5104/JIEPENG.2.46
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摘要: … [7] These previous researchers also found two different phases of η8Cu5Sn4 and η6-Cu5Sn4;[8] however, these were not present in this current research with only the η’-Cu6Sn5 mono…
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