Optical module, method for manufacturing optical module and optical communication apparatus

作者: Toshinori Hirataka , Kimio Tatsuno , Tsutomu Kono , Tadaaki Ishikawa , Toshiaki Ishii

DOI:

关键词:

摘要: An optical module for an device and fiber is constituted by a pre-molded plastic package. In forming the package, main flowing direction of molding resin substantially parallel with axis fiber. The formed injection method using pressure then solidifying resin. When package comprehensive molding, to be installed in module. As result, applied reduced. By case that formed, resulting exhibits high rigidity low thermal expansion properties connection resin, thus reducing external stress

参考文章(26)
Michael J. Robertson, Ian F. Lealman, John V. Collins, The Expanded Mode Laser A Route to Low Cost Optoelectronics IEICE Transactions on Electronics. ,vol. 80, pp. 17- 23 ,(1997)
Naoki Yamamoto, Seimi Sasaki, Kazunori Miura, Optical module encapsulated with resin and manufacturing method therefor ,(1999)
Ian Francis Lealman, John Vincent Collins, Philip John Fiddyment, Roger Alyn Payne, Adrian Richard Thurlow, Packaged optical device ,(1995)
Bertrand Harold Johnson, Greg. E. Blonder, Subassembly for optoelectronic devices ,(1989)
Hiromi Mojikawa, Tadashi Umegaki, Satoru Nagano, Kenji Kunihara, Yoichi Shindo, Resin-sealed laser diode device ,(1994)
I.P. Hall, Non‐hermetic Encapsulation and Assembly Techniques for Optoelectronic Applications Microelectronics International. ,vol. 13, pp. 6- 10 ,(1996) , 10.1108/13565369610800197
I.P. Hall, Novel Techniques for Low‐cost, High Performance, Optoelectronic Component Assembly Microelectronics International. ,vol. 11, pp. 44- 47 ,(1994) , 10.1108/EB044532
Shin Ikegami, Toshimichi Yasuda, Takashi Yamagishi, Mikio Kyomasu, Takeshi Ikeya, Receptacle and method of manufacturing the same ,(1995)