作者: Nam-Soon Choi , Kyoung Han Yew , Wan-Uk Choi , Sung-Soo Kim
DOI: 10.1016/J.JPOWSOUR.2007.11.082
关键词:
摘要: Polyamide imide (PAI), one of the classes of copolyimides containing both high mechanical properties and processibility, is used as a polymeric binder of a Si particulate electrode. The initial coulombic efficiency is improved from 28.9%(Si-PVdF) to 74.9%(Si-PAI) by introducing a PAI binder into a Si-based electrode. Variations in thickness measured at various states of charge (SOCs) and depths of discharge (DODs) indicate that the PAI binder is a much more effective restraint on volume expansion in active Si materials during the charging process …