Defect reference system automatic pattern classification

摘要: A methodology is provided for qualitatively identifying features of an article, such as defects on the surface a semiconductor substrate, with string symbols, numbers, according to relevant defect characteristics and information relating processing tools visited by wafer, including reliability information. Embodiments include generalizing, after wafer discovered inspected (as optical review, SEM, EDS, AFM, etc.), each quantitative attribute defect's size, material composition, color, position etc. into qualitative category, assigning numerical symbol identification, sequencing symbols in predetermined manner. The identification sequences all are stored database, where they easily compared other correspondingly identified defects. sequence also includes number representative wafer's last-visited tool, thereby associating tool. After investigated determined being caused particular fault this linked sequence. Thereafter, if similar occurs another later matched that previous searching indicating same cause defect, enabling ready root causes defects, early corrective action be taken.