The role of elastic and plastic anisotropy of Sn in recrystallization and damage evolution during thermal cycling in SAC305 solder joints
作者： Thomas R. Bieler , Bite Zhou , Lauren Blair , Amir Zamiri , Payam Darbandi
DOI: 10.1007/S11664-011-1811-X
关键词:
摘要: … of Pb mask the dramatically anisotropic properties of Sn. Failures in Sn-based solder joints have been observed in any location of … strains arising from coefficient of thermal expansion (…
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