Method for manufacture of piezoelectric substrate for a saw device

摘要: The present invention provides a composite structure having supporting substrate between piezoelectric and compensation layer. materials used to form the layer in isolation, have higher thermal coefficients of expansion (TCE) relative TCE forming substrate. Once is created, tend expand contract similar manner as temperature changes. contraction forces applied by due changes are substantially countered opposing layer, resulting counteracting one another. Due counteraction, resists bending or warping, reducing increasing stress substrate, thus effective TCF