作者: Hyung-Young Oh , Dae-Yeon Lee , Jae-ik Song , Hyun-Chul Chung , Young-Kuk Kim
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摘要: Disclosed are an apparatus and a method for monitoring glass plate polishing state. The may include location measuring unit on being polished by machine, current electric flowing into the memory storing reference value of machine each plate, control determining whether state is faulty, comparing measured with corresponding stored in location.