Thermally conductive polymer compositions having low thermal expansion characteristics

摘要: An injection moldable, thermally conductive polymer composition that has ultra low CTE properties is provided. The suitable both for substrate applications in high precision electronics assemblies as well over molding conjunction with ceramic substrates. includes a base matrix material loaded filler, which imparts thermal conductivity to the while also maintaining or enhancing dielectric of polymer. resultant exhibits range between 9 ppm/° C. and 2 C., an optical anisotropy below 1.5, greater than W/m° K. use virtually any without introduction mechanical stresses produced by large differentials.