Board through hole working method
作者： Kiyomi Maruyama , Hidehisa Yamagami , Yuzo Kawahara , Yuji Ikeda
DOI:
关键词:
摘要: The object of the present invention is to provide a board through-hole working method which makes it possible form in circuit that does not strip metal plating away when press-fit contact inserted, with amount wear jig being minimized. for (for insertion 101) bored (PCB) and formed conductor (51). comprises step beveling corner edge (50) following formation This performed by pressing pointed jig.
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