Integrated assemblies which include non-conductive-semiconductor-material and conductive-semiconductor-material, and methods of forming integrated assemblies

摘要: Some embodiments include an integrated assembly which has digit-line-contact-regions laterally spaced from one another by intervening regions. Non-conductive-semiconductor-material is over the Openings extend through non-conductive-semiconductor-material to digit-line-contact-regions. Conductive-semiconductor-material-interconnects are within openings and coupled with Upper surfaces of conductive-semiconductor-material-interconnects beneath a lower surface non-conductive-semiconductor-material. Metal-containing-digit-lines Conductive regions downwardly metal-containing-digit-lines couple conductive-semiconductor-material-interconnects. methods forming assemblies.