Circuit device and method of manufacturing the same
作者： Noriaki Sakamoto , Sadamichi Takakusaki
DOI:
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摘要: In a hybrid integrated circuit device that is of the present invention, conductive pattern including pads formed on surface substrate. A first pad to be relatively large since heat sink mounted thereon. second small which chip component or signal transistor fixed. plated film made nickel pad. Therefore, and solder never come into contact with each other. Thus, Cu/Sn alloy layer having poor soldering properties not generated but Ni/Sn excellent generated. Consequently, occurrence in melted suppressed.
google.de 参考文章(191)
Osamu Fujikawa, Katsumi Sagisaka, Mitsuhiro Kondo, Electronic component carriers and method of producing the same as well as electronic devices ,(1993)
Yasushi Kasatani, Bump formation method ,(2000)
Masanori Takeuchi, Process for producing a flexible wiring board ,(2001)
Phillip W. Wallace, Kenneth S. Sanyigo, George G. Gilbert, Michael A. Rosenstock, John T. Bayruns, Plastic packages for microwave frequency applications ,(1993)
H Manko, Methods for electroplating solder ,(1972)
Seung-won Lim, Eun-ho Lee, O-Seob Jeun, Gi-young Jeun, Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same ,(2006)
Kazutaka Shibata, Resin-packaged semiconductor device ,(2001)
James W. Sloan, George W. Hawkins, Sankaranarayanan Ganesan, Howard M. Berg, Scott C. Bolton, Gary L. Lewis, Method for making a moisture resistant semiconductor device having an organic substrate ,(1995)
Hazime Kato, Power module device ,(1995)